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Advanced Electronics Packaging Digest

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Flex Connections: Is a Printed Silver Ink Circuit Right for Your Application?

10/27/2026 | Terrill Schmidt -- Column: Flex Connections
When is the right time to design a flexible circuit with printed ink, usually silver, vs. a flexible etched copper circuit, a die-cut copper circuit, or a die-cut aluminum circuit? First, a flexible circuit design must work in the application as designed and be cost-effective so the end product can be sold or used. What drives a designer to choose between an etched copper circuit, printed ink, flat flexible cable, die-cut copper, or die-cut aluminum? Multiple factors influence the design.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

MacDermid Alpha Shares Advanced Metallization Expertise at IMPACT and TPCA Show 2026

10/15/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will present four technical papers at the IMPACT Conference 2026 and two additional presentations at the Tech X Total Solutions forum during the TPCA Show in Taipei.

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

10/15/2026 | Global Electronics Association
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion
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