BAE Systems Adapts Bone Conduction Technology to Aid Soldiers on the Battlefield
September 15, 2015 | BAE SystemsEstimated reading time: 1 minute
BAE Systems has developed an innovative communication device to aid armed forces personnel on the battlefield.
The prototype system is designed to improve soldier safety and drive mission success by harnessing the body's natural ability to transmit sound through bone conduction, transferring messages directly from the soldier’s helmet to the inner ear. It is being developed as part of Company-funded research which aims to reduce the burden on the dismounted soldier through wearable technology.
Soldiers need to be able to receive audio communications to maximise their awareness and understanding of the challenging environments they are working in, whilst also protecting themselves from extremely loud noises such as gunfire. To address these conflicting requirements, BAE Systems engineers have adapted existing bone conduction technology often used in commercial headphones and hearing aids for the military domain.
The resulting solution significantly improves the performance of the device and minimising the size and weight of the transducer to the size of a five pence coin. Leveraging off-the-shelf technology to engineer the prototype has allowed the team to significantly reduce development time and costs.
Mohammed Akhmad, Principal Scientist at BAE Systems, said: "We recognise that on the battlefield, auditory situational awareness is essential for armed forces personnel. With this system, the soldiers can safeguard their hearing with ear protectors whilst still clearly receiving military voice communications, to enable them to perform their roles efficiently and safely.
"Through collaborating directly with our customer, we are able to understand their operational challenges and translate them into technical solutions. The key to this concept is that we have been able to utilise off-the-shelf technology and apply our specialist engineering expertise to greatly reduce the time it takes to develop a new prototype. In doing so, we have developed an audio system that offers enhanced capabilities for the military domain."
In the future this technology will be incorporated into future integrated helmets. A concept demonstrator for BAE Systems' bone conduction technology will be on display at DSEI (Defence and Security Equipment International), in London this year.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.