-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
SMTA Silicon Valley Chapter Meeting to Highlight LEDs
October 7, 2015 | SMTAEstimated reading time: Less than a minute
The SMTA Silicon Valley Chapter's October Chapter Meeting will focus on LEDs, and will feature presentations by Denis C. Barbini, PhD, of Universal Instruments' Advanced Process Laboratory; Amit D. Patel, from Alpha - Energy Technologies; and Tom Moore of Henkel Electronics Materials.
Dr. Barbini will talk about developing a manufacturing process for LED electronics, and will identify key elements in design and manufacturing of LEDs that yield a robust assembly process. In addition, several case studies will be highlighted, providing the attendee with an understanding of how to deal with the dynamic range of LED technology.
In his presentation, Patel will talk about enabling the use of PET flexible substrates for LED lighting applications. Moore, on the other hand, will focus on the importance of thermal management for LED designs, and will discuss both the TIM (Thermal Interface Materials) as well as MCPCB (Metal Clad Printed Circuit Board) for dissipating heat.
The October Chapter Meeting will be held on October 22 at Bestronics (2090 Fortune Drive, San Jose, California 95131), from 3pm to 6pm.
To register, click here.
Suggested Items
SMTA Ontario Presents Webinar on Achieving Enhanced Reliability with a Novel Lead-Free, Bismuth-Free, Low-Temperature Solder
01/09/2025 | SMTAThe Ontario Chapter of the Surface Mount Technology Association (SMTA) invites electronics industry professionals to a technical webinar featuring Emily Belfield, Regional Sales Manager at Indium Corporation.
Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
12/11/2024 | Nano DimensionNano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/08/2024 | Nolan Johnson, I-Connect007In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.