LTE will Become the Leading Technology for Cellular IoT Devices in 2019
October 16, 2015 | Berg InsightEstimated reading time: 1 minute
A new research report from Berg Insight predicts that LTE will become the leading technology for cellular IoT devices in 2019. Berg Insight forecasts that global shipments of cellular IoT devices will grow at a compound annual growth rate (CAGR) of 20.1 percent to reach 239.7 million units in 2020. LTE device shipments started to take off in 2015 and are expected to surpass GPRS devices in four years’ time. “2G is still growing rapidly in emerging markets and has a clear cost advantage in Europe. The economics of 4G is however dramatically improved with LTE Cat-0 and the upcoming LTE-M standard. Once these are in place there will be no more significant barriers left against migration from 2G”, says Tobias Ryberg, Senior Analyst, Berg Insight and author of the report.
As a result of the direct move from 2G to 4G, Berg Insight believes that 3G will only serve as an interim technology in cellular IoT. Annual shipments of 3G cellular IoT devices are predicted to peak in 2018. Instead the main alternative to 4G cellular technologies will be Low Power Wide Area (LPWA) networking technologies. Berg Insight believes that the 3GPP’s recent initiative to define a new narrowband radio technology for IoT (NB-IOT) is highly significant and creates a unique opportunity for the mobile industry to include a new set of applications into its domain. “A global universal standard for lightweight IoT communication on public networks is essential for driving the market forward”, concludes Mr Ryberg.
About Berg Insight
Berg Insight is a dedicated M2M/IoT market research firm based in Sweden. We have been specialising in all major M2M/IoT verticals such as fleet management, car telematics, smart metering, smart homes, mHealth and industrial M2M since 2004. Our vision is to be the most valuable source of intelligence for our customers. Berg Insight offers numerous market reports, detailed market forecast databases and advisory services. We provide custom research tailored to your requirements including focussed research papers, business case analysis, go-to-market strategies and bespoke market forecasting. In addition to M2M/IoT, we are also active within Location-Based Services, mobile Value-Added Services and Next Generation Technologies. We have provided analytical services to 750 clients in 69 countries on six continents to date. Our customers range from many of the world’s largest mobile operators, IT companies and telecom vendors, to venture capitalists, technology start-ups and specialist consultants.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).