New Technique Removes Defects While Keeping Materials Strong
October 20, 2015 | Carnegie Mellon UniversityEstimated reading time: 2 minutes
When designing a new material, whether for an airplane, car, bridge, mobile device, or biological implant, engineers strive to make the material strong and defect-free. However, methods conventionally used to control the amount of defects in a material, such as applying heat or mechanical stress, can also have undesirable consequences in terms of the material’s strength, structure and performance.
An international team of researchers, including Carnegie Mellon University President Subra Suresh, Zhiwei Shan and colleagues from Xi’an Jiaotong University in China, Ming Dao and Ju Li from MIT, and Evan Ma from Johns Hopkins University, has developed a new technique called cyclic healing that uses repetitive, gentle stretching to eliminate pre-existing defects in metal crystals. Their results have been published online today (Monday, Oct. 19) in the Proceedings of the National Academy of Sciences.
Most materials are made of crystals. When materials fail, it is usually the result of defects in the crystal or in the arrangement of multiple crystals in a polycrystalline structure. While much research has been done on metal fatigue at larger scales, new technologies are just now allowing researchers to see how atomic-scale defects nucleate, multiply and interact in materials subjected to monotonic or fatigue loading inside a high-resolution microscope.
In this study, the researchers used transmission electron microscopy to look inside sub-micrometer-sized specimens of aluminum crystals as they subjected the samples to stressors like repeated, small-amplitude deformation or fatigue loading. They found that gentle cyclic deformation, a process that repetitively stretches the crystal, helps to unpin or shakedown rows of atomic defects known as dislocations in the metal and move these dislocations closer to free surfaces in the sample. Image forces, which act to minimize the energy of the defects, attract the dislocations closer to the free surfaces and force them out of the crystal. As a result, the crystal “heals,” becoming essentially free of pre-existing dislocations, thereby significantly increasing its strength.
This finding was surprising to researchers because cyclic deformation has an opposite effect in micro- and macro-scale metal crystals. In these larger samples, repeated stretching generally leads to the creation, accumulation and interaction of defects, which can cause cracking and failure.
“This work demonstrates how cyclic deformation, under certain controlled conditions, can lead to the removal of defects from crystals of small volume,” says Suresh, who holds the Henry L. Hillman President’s Chair at CMU. “It also points to potential new pathways for engineering the defect structure of metal components in a variety of sub-micro-scale systems.”
Suggested Items
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial TeamDuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.