Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Nexperia Builds Momentum with Continued Growth in Q3 2026

10/27/2026 | Nexperia
Nexperia announced its financial results for the third quarter of 2026. Building on the progress achieved during the first half of 2026, Nexperia delivered another consecutive quarter of revenue growth in Q3, supported by recovering customer demand and production capacity.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

Samsung Electro-Mechanics Signs KRW 360.5 Billion Package Substrate Supply Deal

10/21/2026 | Samsung Electro-Mechanics
Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.

NVIDIA, Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

10/21/2026 | Globe Newswire
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.

Muon Space Expands Leadership Team as Company Scales Constellation Programs

10/19/2026 | Muon Space
Muon Space, the Mission Foundry for high-performance satellite constellations, announced two additions to its leadership team as the company scales production and expands a growing portfolio of commercial and government constellation programs. Jody Kelman has joined Muon as Chief Product Officer, and Emelia Probasco has joined as Head of Strategy and Communications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in