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Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits

07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth Elektronik
Inherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.

Teledyne Acquires Maretron

07/02/2025 | BUSINESS WIRE
Teledyne Technologies Incorporated announced the acquisition of assets of Maretron, including the brand’s Octoplex, MPower and MConnect product lines from Littelfuse, Inc..

ASC Sunstone Circuits and Screaming Circuits Partner to Launch Online Assembly Parts Ordering – A New Step Toward Seamless PCB Production

06/23/2025 | ASC Sunstone
In a major step toward simplifying the PCB manufacturing and assembly process, ASC Sunstone Circuits and Screaming Circuits are proud to announce the launch of a new online assembly parts ordering feature, now available through Sunstone.com. This enhanced capability allows customers to source assembly components as part of their PCB order, creating a fully integrated experience from bare board fabrication to finished assembly.

The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.

Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away

06/17/2025 | Jesse Vaughan -- Column: Beyond the Board
“The next war might be won—or lost—22,000 miles above Earth.” That’s not science fiction. It’s the stark reality defense planners are beginning to confront as space transitions from a support domain to a full-spectrum warfighting environment. For decades, the United States held an uncontested advantage in space, relying on exquisite, few, and highly capable systems to enable precision warfare, real-time intelligence, and global communications. Today, that edge is under siege.
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