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Airbus, Unseenlabs to Develop France’s Future Military Signal Intelligence Satellites

09/11/2026 | Airbus
On the sidelines of the International Space Summit, Catherine Vautrin, France’s Minister for the Armed Forces and Veterans’ Affairs, announced that the Directorate-General for Armament (DGA) had awarded the CASSIOPÉE contract to Airbus Defence and Space as the lead contractor and its co-contractor Unseenlabs, thereby initiating the renewal of France’s space-based signal intelligence (SIGINT) capability.

Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.

Real Time with... THECA 2026: Thailand's Electronics Industry Growth and Challenges

09/10/2026 | Real Time with... THECA
Expressing pride in this year's THECA event and some of the challenges encountered in putting together the important event, Phutana Daoruang, general manager of THPCA, discusses the rapid growth of Thailand's PCB, EMS, and chip packaging industries and the critical workforce shortage. He also outlines strategic initiatives to address these challenges and foster industry development.

DYCONEX Establishes BIOCONEX to Extend its Medical Technology Portfolio

09/09/2026 | DYCONEX
DYCONEX AG announces the establishment of BIOCONEX AG, a wholly owned Swiss subsidiary dedicated to transforming substrate technologies manufactured by DYCONEX into customer-specific, ready-to-integrate sub-components for medical devices.
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