-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ACE Introduces Revolutionary Low Cost Dip and Look Solderability Tester
November 4, 2015 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce the introduction of its revolutionary low cost STS-202 dip and look solderability test system.
The new ACE solderability tester is capable of performing solderability testing to determine the solderability of component leads and terminations prior to being joined in a soldering operation. The system utilizes the proven dip and look test method in conformance with all IPC, ANSI and MIL standards including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208.
The well-defined dip and look solderability testing method is an easy way to perform qualitative type testing utilizing a straightforward comparative analysis technique. And since the dip and look test can be performed rapidly it can be effectively used in receiving inspection or on a production floor as well as in a testing laboratory.
Designed to automate the physical testing process, the benchtop STS-202 solderability tester utilizes high precision motion control, easy touch screen programming and precise PID temperature controls for complete process control throughout the entire testing operation. The new ACE solderability tester is an intelligent dual purpose system that can be used for solderability testing as well as for manual component lead tinning for low volume applications.
Removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation are the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. It is highly recommended the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with GEIA-STD-0006 to enhance component solderability.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.