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Advanced Electronics Packaging Digest

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Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies

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Why Gold Layer Thickness in ENIG Matters for Soldering

02/07/2023 | Britta Schafsteller, Mario Rosin, Gustavo Ramos, and Joe McGurran, Atotech
The main task of the final finish is to protect the copper pad from tarnishing or oxidation while simultaneously keeping the surface active for the assembly. Electroless nickel/immersion gold (ENIG) is a widely accepted finish in the market that provides a good solderability and capability for Al-wire bonding. A main function of the gold layer is to prevent the oxidation of the nickel layer.
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