Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
SMTA's Pan Pacific Microelectronics Symposium Program Finalized
November 11, 2015 | SMTAEstimated reading time: 1 minute
SMTA announced that the program is finalized for the 21st Annual Pan Pacific Microelectronics Symposium. The event will take place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Nanotech Joining, Automotive Electronics, Solder Technologies, Optoelectronics and Power, Design and Manufacturing Strategies, Advanced X-Ray Inspection, Wearable Electronics, Materials Reliability Impact, Interposer Technologies (TSV), Reliability Strategies, Test and Failure Analysis.
On the afternoon of Monday, January 25, a plenary keynote session will kick off the event featuring presentations on Application of Nanostructuring, Nanomaterials, and Micro-Nano-Integration
for Improved Components and System's Performance; 3D-Printing and Electronic Packaging; New Lithium Ion Cell Technologies; Digital Health; and Employee Job Satisfaction and Leadership Style.
On Tuesday, January 26, Dwight Howard, Delphi, will deliver the keynote lunch talk on “The Rapid Evolution of Automotive Features and Demands for Advanced Microelectronics Solutions.” On Wednesday, January 27, Michael Pecht, Ph.D., University of Maryland, will deliver the lunch keynote on “Re-thinking Reliability - A Perspective from a U.S. National Academy of Science Study Committee.” Meyya Meyyappan, Ph.D., NASA Ames Research Center, will deliver the final keynote lunch presentation about “Nanotechnology in Future Nanoelectronics” on Thursday, January 28.
View the complete program and register at the website: http://www.smta.org/panpac. Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Jae Gullings, jae@smta.org, for details.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.