-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA's Pan Pacific Microelectronics Symposium Program Finalized
November 11, 2015 | SMTAEstimated reading time: 1 minute
SMTA announced that the program is finalized for the 21st Annual Pan Pacific Microelectronics Symposium. The event will take place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Nanotech Joining, Automotive Electronics, Solder Technologies, Optoelectronics and Power, Design and Manufacturing Strategies, Advanced X-Ray Inspection, Wearable Electronics, Materials Reliability Impact, Interposer Technologies (TSV), Reliability Strategies, Test and Failure Analysis.
On the afternoon of Monday, January 25, a plenary keynote session will kick off the event featuring presentations on Application of Nanostructuring, Nanomaterials, and Micro-Nano-Integration
for Improved Components and System's Performance; 3D-Printing and Electronic Packaging; New Lithium Ion Cell Technologies; Digital Health; and Employee Job Satisfaction and Leadership Style.
On Tuesday, January 26, Dwight Howard, Delphi, will deliver the keynote lunch talk on “The Rapid Evolution of Automotive Features and Demands for Advanced Microelectronics Solutions.” On Wednesday, January 27, Michael Pecht, Ph.D., University of Maryland, will deliver the lunch keynote on “Re-thinking Reliability - A Perspective from a U.S. National Academy of Science Study Committee.” Meyya Meyyappan, Ph.D., NASA Ames Research Center, will deliver the final keynote lunch presentation about “Nanotechnology in Future Nanoelectronics” on Thursday, January 28.
View the complete program and register at the website: http://www.smta.org/panpac. Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Jae Gullings, jae@smta.org, for details.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.