Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
SMTA's Pan Pacific Microelectronics Symposium Program Finalized
November 11, 2015 | SMTAEstimated reading time: 1 minute
SMTA announced that the program is finalized for the 21st Annual Pan Pacific Microelectronics Symposium. The event will take place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.
The technical sessions, with over 50 presentations, will include Nanotech Joining, Automotive Electronics, Solder Technologies, Optoelectronics and Power, Design and Manufacturing Strategies, Advanced X-Ray Inspection, Wearable Electronics, Materials Reliability Impact, Interposer Technologies (TSV), Reliability Strategies, Test and Failure Analysis.
On the afternoon of Monday, January 25, a plenary keynote session will kick off the event featuring presentations on Application of Nanostructuring, Nanomaterials, and Micro-Nano-Integration
for Improved Components and System's Performance; 3D-Printing and Electronic Packaging; New Lithium Ion Cell Technologies; Digital Health; and Employee Job Satisfaction and Leadership Style.
On Tuesday, January 26, Dwight Howard, Delphi, will deliver the keynote lunch talk on “The Rapid Evolution of Automotive Features and Demands for Advanced Microelectronics Solutions.” On Wednesday, January 27, Michael Pecht, Ph.D., University of Maryland, will deliver the lunch keynote on “Re-thinking Reliability - A Perspective from a U.S. National Academy of Science Study Committee.” Meyya Meyyappan, Ph.D., NASA Ames Research Center, will deliver the final keynote lunch presentation about “Nanotechnology in Future Nanoelectronics” on Thursday, January 28.
View the complete program and register at the website: http://www.smta.org/panpac. Please contact Tanya Martin, tanya@smta.org or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Jae Gullings, jae@smta.org, for details.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.