Molecule that Self-assembles into Flower-shaped Crystalline Patterns
December 1, 2015 | Indiana UniversityEstimated reading time: 4 minutes
Specifically, Flood said, the ability to alternate different molecules in highly ordered patterns is a key step in creating organic electronics, a new class of material whose applications include highly efficient solar panels and advanced computer circuitry.
"The best solar cells right now are made of extremely pure silicon, which requires a very precise -- and expensive -- production process," Tait said. "But if we can create extremely pure, self-assembling organic materials, controlling the order of their interfaces and components at the molecular level, the performance of these organic materials will improve significantly, and their costs will go down."
Most important for the creation of new molecular structures, the IU team will use the grant to develop computer-aided design software enabling virtual experimentation with the potential to examine the millions of molecular compounds of interest to material scientists.
Currently, Flood explained, scientists must engage in an arduous and time-consuming process of trial-and-error to design new structures with highly specialized properties since no blueprint exists for how molecules will react upon coming into contact with each other. But with virtual experimentation, molecular engineers could screen 100 potential molecular combinations over 100 days, only then devoting time and resources to synthesize the top five candidates, which can itself require about 100 days per compound, creating enormous time-savings.
"CAD software is prevalent in electrical, mechanical and civil engineering, and we need that same technology at our fingertips for molecular and materials engineering," Flood said. "The innovations coming from our computational collaborators are key."
These collaborations are with Ortoleva, a Distinguished Professor in the IU Bloomington Department of Chemistry who will help develop the CAD software using recent advances in multi-scale simulation that employ Baik's work on atomic-level force fields.
"Ultimately, we plan to show experimentally how molecules can be programmed so that they assemble themselves into 2-D and 3-D arrangements, as well as produce a working, operational and accurate simulation software," Flood added. "Our goal will be to achieve high fidelity between theory, design and experimentation."
Page 2 of 2Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
09/17/2025 | PRNewswireOrthogone Technologies Inc., a leader in advanced embedded systems and FPGA development, is proud to announce its official designation as a Texas Instruments (TI) Design Services Partner.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
09/17/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again be exhibiting at PCB West 2025 to be held at the Santa Clara Convention Center on Wednesday, October 1, 2025.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.