Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Career Technology and Flexium Report Lower Revenues for November
December 11, 2015 | DigitimesEstimated reading time: Less than a minute
Taiwan-based flexible PCB suppliers Career Technology and Flexium Interconnect have reported sequential decreases of 2.6%, and 22.2%, respectively, in November 2015 revenues, according to a Digitimes report.
Career Tech announced November revenues of NT$1.55 billion (US$47.3 million), down by 21.4% compared to the same month in 2014. The company's cumulative 2015 revenues through November decreased 0.6% from a year earlier to NT$14.55 billion.
Flexium, meanwhile, generated revenues of NT$1.88 billion in November, down from the record high of NT$2.41 billion the company hit in October, the report added.
Share on:
Suggested Items
Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity
11/27/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence.
WSTS Semiconductor Market Forecast Spring 2024
11/26/2024 | WSTSWSTS has adjusted its Spring 2024 forecast upwards, projecting a 16.0 percent growth in the global semiconductor market compared to the previous year.
Server DRAM and HBM Boost 3Q24 DRAM Industry Revenue by 13.6% QoQ
11/26/2024 | TrendForceTrendForce’s latest investigations reveal that the global DRAM industry revenue reached US$26.02 billion in 3Q24, marking a 13.6% QoQ increase.
Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona
11/15/2024 | U.S. Chamber of CommerceTSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
GPV’s Interim Financial Report Q3 2024: Keeping Pace in Challenging Market
11/15/2024 | GPVGPV reported sales of DKK 2.2 billion and earnings (EBITDA) of DKK 186 million for Q3 2024. This was a slight decline compared to the same quarter in the record year of 2023, and thus, GPV kept pace in a global market affected by continued market rebalancing and declining end-customer demand.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in