IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals
December 15, 2015 | IPCEstimated reading time: 2 minutes

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.
Supplier Declaration
The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. The committee discussed the use of special characters in smelter names and potential revisions to some of the declaration questions in order to improve clarity and usability. The committee decided to meet monthly work towards publishing a revision of the standard in 2017.
Environment, Health, and Safety
The 4-33 Halogen Free Laminate Materials Subcommittee reviewed what comments from this subcommittee, if any, would be helpful in steering the U.S. EPA in its TSCA work plan to study Tetrabromobisphenol A (TBBPA). Fern Abrams was able to lend some sanity to the discussion and the subcommittee decided to wait for the IPC-constructed comments that will be submitted to the EPA.
Management
The 8-41 Technology Roadmap Subcommittee discussed ways to improve the IPC International Technology Roadmap for Electronic Interconnection and to increase its reach to the greater electronics manufacture industry. From this brainstorming session, the group will strategize the continual awareness of the 2015 version and enhancements which can be made to the 2017 version.
Embedded Devices
Based on significant feedback following publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, the D-55 Embedded Devices Process Implementation Subcommittee is beginning work on an amendment or A revision of the standard. The subcommittee will make a decision on the best route to take IPC-7092 based on the amount of new information or inquiries for expanded topics it receives.
Page 1 of 2
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Delta Electronics Posts 26.7% Growth in Sales Revenues for August
09/12/2025 | Delta ElectronicsDelta Electronics, Inc. announced its consolidated sales revenues for August 2025 totaled NT$47,860 million, a 26.7 percent increase as compared to NT$37,770 million for August 2024 and a 5.4 percent increase as compared to NT$45,397 million for July 2025.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.