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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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AI Boom Drives Global PCB Material Shortages, Warn Würth Elektronik and STARTEAM GLOBAL

07/30/2026 | STARTEAM GLOBAL
The rapid expansion of AI data centers and high-performance computing is creating a new supply chain bottleneck, with printed circuit board (PCB) base materials becoming increasingly scarce worldwide, according to Würth Elektronik and STARTEAM GLOBAL.

Axcelis Announces Successful Purion XEmax Eval Closure at Leading Semiconductor Foundry

07/28/2026 | PRNewswire
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced the successful Purion XEmax™ high energy implanter evaluation closure at a leading foundry.

JLC Digital Manufacturing Achieves PCI DSS v4.0.1 Level 1 Certification

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JLC Digital Manufacturing has achieved Payment Card Industry Data Security Standard (PCI DSS) v4.0.1 Level 1 certification, the highest level of PCI DSS compliance.

Mycronic Secures SLX Mask Writer Order in Asia

07/23/2026 | Mycronic
Mycronic AB has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the second quarter of 2027.

Keiron Printing Technologies Raises €20.7M to Revolutionize LiFT Precision Solder Paste Printing for High-Reliability Electronics

07/22/2026 | Keiron Printing Technologies
Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.
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