Alpha Talks Challenges of Solder Recycling
December 22, 2015 | Patty Goldman, I-Connect007Estimated reading time: 13 minutes
Fullerton: I joke that it's the evil that we know versus the evil we don't know. We have a very good handle on the life cycle of tin-lead solder based on research and historical usage. We have not even 10 years doing lead-free. We still don't have that 30, 40, 50-year life cycle product that has actually been in the field long enough to see how those react.
Goldman: Like those airplanes.
Fullerton: Right, exactly. Those segments still stay with tin-lead because they can quantify the reliability and they can plan around that. With the lead-frees, the long, long term reliability still hasn't been proven out, pro or con. Those industries are afraid of the unknown. They'd rather quantify it and plan around it, so that's where they still live.
Goldman: When you need the ultimate reliability, you stick with what you know that has the reliability.
Fullerton: Yep, I want the airplane that takes me home to Philadelphia tomorrow to have the most reliable solder possible.
Goldman: And I don't care about anything else.
Fullerton: Exactly.
Goldman: Wonderful. Well, thanks for stopping by Jason.
Fullerton: No problem. Thanks for having me.
Page 3 of 3Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.