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Panel-Level Packages, A Promising Market
December 22, 2015 | Yole DéveloppementEstimated reading time: 3 minutes
Under this approach, the market research company highlights the key insights of this industry and details the range of applications. “Panel’s application scope could be segmented into three categories defined by the required resolution,” announces Amandine Pizzagalli from Yole:
- High-end products like networks, CPU /GPU , FPGA , and servers will necessitate a resolution reduced to 2 µm. Therefore, this area is likely to be dominated by 300 mm lines where the front-end is already well-established and has the L/S capability to achieve such resolution.
- Midrange products including basebands, processors, power management modules, and RFIC should be the main target of FOWLP based on panel and glass panel interposers.
And organic interposers should be restricted to low-end products: mobile, consumer, WiFi, and power management.
Business is there for the taking! But, how to design the ideal supply chain to support high-volume manufacturing… Yole’s report provides an in-depth analysis of the panel industry, its future development and related drivers covering platforms such as FO WLP panel, embedded die, organic interposer, glass panel interposer and hybrid interposer. A detailed description of the report is available on i-micronews.com, Advanced Packaging reports section.
Yole and its advanced packaging team, are closely studying and monitoring the industry’s activities in the advanced packaging field. Yole’s vision will be presented during the European 3D TSV Summit 2016 taking place in Grenoble, France, from January 18 to 20, 2016. The company is partnering with SEMI organization to support the European TSV Summit. The European 3D TSV Summit is organized by SEMI Europe. To meet Yole’s experts, discover the detailed program and register, click European 3D TSV Summit.
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