Global Citizenship: Understanding Global Citizenship as a Competitive Advantage
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Pete’s Top Ten SMT Articles for 2015
December 28, 2015 | Pete Starkey, I-Connect007Estimated reading time: 3 minutes
The trend toward outsourcing in the automotive industry continues as automotive manufacturers strive to capitalize on the technical expertise and cost effectiveness of the EMS providers. For their part, the automotive EMS players have expanded their role through vertical integration and venture into the realm of non-electronics manufacturing.
7. Value Stream Mapping—Operationalizing Lean Manufacturing
by applying value stream mapping (VSM), EMS providers can have a clearer picture of multiple processes involved in a work flow, identify waste and its sources, identify where change is required, standardize the process, and identify potential problems that could be encountered in the future state. It can also be used as a tool for planning as well as for managing changes.
8. Jetting Strategies for mBGAs—A Question of Give and Take
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.
9. The Unpredictability of Tin Whiskers Endures
Into decade number two of the European Union’s RoHS and REACH restrictions for the use of lead in electronic components, the risk of tin whiskers in critical circuitry continues. This article will explore a tin whisker mitigation process for surface mount electronic components applicable to both passive and active components.
10. Enclosed Media Printing as an Alternative to Metal Blades
The evolution of PCBs in terms of the miniaturization of assemblies, components, and ever-finer feature print patterns has not slowed, and as a result continues to present ever-increasing challenges to the makers of assembly equipment and solder paste printing technology, narrowing the process window. In this article, Michael l. Martel discusses how enclosed media print head technology has kept up to these challenges.
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