2015’s Most Read SMT News Items
December 29, 2015 | I-Connect007Estimated reading time: 2 minutes
Alpha is expanding its capabilities to meet the growing needs of its customers by establishing a new advanced manufacturing and training facility in Chennai, India. The facility, an addition to their existing 16,000sqm campus, will have the capability to produce ALPHA’s vast product line including bar solder, cored wire, solder paste, wave solder flux and cleaners.
MMI Releases List of Top 50 EMS Firms Worldwide
In 2014, sales of the Top 50 EMS companies worldwide reached a new high of $265 billion – more than 4% or $10 billion than in 2013. Company growth rates in revenue ranged from 50+ percent to -20%, with the majority exhibiting very positive numbers.
Valtronic Wins Award from Mentor Graphics
Valtronic announces that Valtronic SA received 2nd place in Mentor Graphics’ 25th annual PCB Technology Leadership Awards in the category of Industrial Control, Instrumentation, security & Medical. Valtronic proposed a complex board for a magnetic resonance image receiver using Mentor Graphics’ Xpedition Enterprise software.
Bittele Electronics Completes New PCB Assembly Line
Bittele Electronics, a Toronto-based firm specializing in prototype and low volume printed circuit board assembly, has completed the construction of a new, fully automated PCB assembly production line featuring state-of-the-art technology, for prototype and low volume assembly.
Plexus Secures Accreditation from U.S. DoD
Plexus Corp., today announced that its wholly owned subsidiary, Plexus Aerospace, Defense and Security Services, LLC, has received accreditation as a Microelectronics Trusted Source by the Defense Microelectronics Activity (DMEA).
Creation Technologies Welcomes Congressman Paul Ryan in Wisconsin Facility
“Creation Technologies is on the cutting edge of our economy. They’re promoting innovation and creating the jobs of the 21st century. We’ve got to streamline the regulatory process so more manufacturers in southeast Wisconsin can expand opportunity from the bottom up,” said Congressman Paul Ryan.
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Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.