2015’s Most Read SMT News Items
December 29, 2015 | I-Connect007Estimated reading time: 2 minutes
Alpha is expanding its capabilities to meet the growing needs of its customers by establishing a new advanced manufacturing and training facility in Chennai, India. The facility, an addition to their existing 16,000sqm campus, will have the capability to produce ALPHA’s vast product line including bar solder, cored wire, solder paste, wave solder flux and cleaners.
MMI Releases List of Top 50 EMS Firms Worldwide
In 2014, sales of the Top 50 EMS companies worldwide reached a new high of $265 billion – more than 4% or $10 billion than in 2013. Company growth rates in revenue ranged from 50+ percent to -20%, with the majority exhibiting very positive numbers.
Valtronic Wins Award from Mentor Graphics
Valtronic announces that Valtronic SA received 2nd place in Mentor Graphics’ 25th annual PCB Technology Leadership Awards in the category of Industrial Control, Instrumentation, security & Medical. Valtronic proposed a complex board for a magnetic resonance image receiver using Mentor Graphics’ Xpedition Enterprise software.
Bittele Electronics Completes New PCB Assembly Line
Bittele Electronics, a Toronto-based firm specializing in prototype and low volume printed circuit board assembly, has completed the construction of a new, fully automated PCB assembly production line featuring state-of-the-art technology, for prototype and low volume assembly.
Plexus Secures Accreditation from U.S. DoD
Plexus Corp., today announced that its wholly owned subsidiary, Plexus Aerospace, Defense and Security Services, LLC, has received accreditation as a Microelectronics Trusted Source by the Defense Microelectronics Activity (DMEA).
Creation Technologies Welcomes Congressman Paul Ryan in Wisconsin Facility
“Creation Technologies is on the cutting edge of our economy. They’re promoting innovation and creating the jobs of the 21st century. We’ve got to streamline the regulatory process so more manufacturers in southeast Wisconsin can expand opportunity from the bottom up,” said Congressman Paul Ryan.
Page 2 of 2Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.