Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Program Seeks Ability to Assemble Atom-sized Pieces Into Practical Products
December 30, 2015 | DARPAEstimated reading time: 1 minute
DARPA recently launched its Atoms to Product (A2P) program, with the goal of developing technologies and processes to assemble nanometer-scale pieces—whose dimensions are near the size of atoms—into systems, components, or materials that are at least millimeter-scale in size. At the heart of that goal was a frustrating reality: Many common materials, when fabricated at nanometer-scale, exhibit unique and attractive “atomic-scale” behaviors including quantized current-voltage behavior, dramatically lower melting points and significantly higher specific heats—but they tend to lose these potentially beneficial traits when they are manufactured at larger “product-scale” dimensions, typically on the order of a few centimeters, for integration into devices and systems.
DARPA recently selected 10 performers to tackle this challenge: Zyvex Labs, Richardson, Texas; SRI, Menlo Park, California; Boston University, Boston, Massachusetts; University of Notre Dame, South Bend, Indiana; HRL Laboratories, Malibu, California; PARC, Palo Alto, California; Embody, Norfolk, Virginia; Voxtel, Beaverton, Oregon; Harvard University, Cambridge, Massachusetts; and Draper Laboratory, Cambridge, Massachusetts.
“The ability to assemble atomic-scale pieces into practical components and products is the key to unlocking the full potential of micromachines,” said John Main, DARPA program manager. “The DARPA Atoms to Product Program aims to bring the benefits of microelectronic-style miniaturization to systems and products that combine mechanical, electrical, and chemical processes.”
The program calls for closing the assembly gap in two steps: From atoms to microns and from microns to millimeters. Performers are tasked with addressing one or both of these steps and have been assigned to one of three working groups, each with a distinct focus area.
To view summary descriptions of each performer's planned work within the three working groups click here.
Share on:
Suggested Items
Toni Patzner Becomes Global Head of Supply Chain Management at ASMPT SMT Solutions
07/01/2025 | ASMPTOn June 1, 2025, Toni Patzner assumed the position of Global Head of Supply Chain Management. The experienced manager succeeded Jörg Cwojdzinski, who retired after decades of service.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
It’s Only Common Sense: Selling to Today's Generation of Buyers
06/30/2025 | Dan Beaulieu -- Column: It's Only Common SenseMillennials and Gen Z hold significant purchasing power and influence in industries worldwide. Selling to them requires adapting to their unique preferences, behaviors, and values, and exploring their buying habits, embracing their emphasis on social values, and mastering digital communication. Unlike previous generations, they prioritize experiences, sustainability, and value.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Chiplets and the Like are Redefining Microelectronics
06/25/2025 | productronicaThe performance of modern AI and high-performance computing applications can only be achieved with high-performance semiconductor technology.