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2015’s Most Read SMT Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This article outlines a series of passive thermal improvements that are easily integrated into legacy systems and can provide a 3-4x increase in dissipated power.
Benefits of Soldering with Vacuum Profiles
Requirements for void-free solder joints are continuously increasing in the field of electronics manufacturing, bringing new challenges that are evolving on a daily basis due to the relentless introduction of new variants of so-called bottom-terminated components (BTCs).
NEPCON China Showcases Latest Manufacturing Tech in Asia
Considered Asia’s biggest, most influential SMT and electronics manufacturing event, NEPCON China 2015 attracted over 450 leading brands from 22 countries, who showcased the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm.
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering is difficult to detect by monitoring electric resistance since it initiates before an electrical failure occurs. This article presents the results of pad cratering susceptibility of laminates using the acoustic emission method under four-point bend and compares the AE results to the pad-solder level testing results.
EMI-caused EOS Sources in Automated Equipment
Electrical overstress causes damage to sensitive components, including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This article analyses sources of such noise, how it affects components and how to mitigate this problem.
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