American Made Advocacy: Batting .333: Great in Baseball, Not in Microelectronics
It’s Only Common Sense: The Best Cold Calling Ideas of All Times
The Doctor’s In: Reliability in the Delivery RoomNOAA's GOES-S, T and U Satellites Are Shaping Up
January 10, 2016 | NASAEstimated reading time: 2 minutes
As NOAA's GOES-R satellite goes through mechanical testing in preparation for launch in October 2016, the remaining satellites in the series (GOES-S, T, and U) are also making significant progress.
Six new instruments will fly aboard each of the GOES-R series satellites: Advanced Baseline Imager (ABI), Extreme Ultraviolet and X-ray Irradiance Sensors (EXIS), Geostationary Lightning Mapper (GLM), Magnetometer, Space Environment In Situ Suite (SEISS), and Solar Ultraviolet Imager (SUVI). In addition to these instruments the spacecraft itself, known as the "bus," antennas, flight hardware and software, and other components are also being completed.
Together, the instruments will offer advanced imaging with increased resolution and faster coverage for more accurate forecasts of environmental phenomena like: severe storms, fog, fire, aerosols and volcanic ash, as well as real-time mapping of lightning activity. The instruments will also enable NOAA’s Space Weather Prediction Center to significantly improve forecasts of space weather hazards.
GOES-S Satellite Progress
All GOES-S instruments have been delivered for integration with the satellite and SUVI and EXIS are already installed on the sun-pointing platform. Significant progress has been made on the GOES-S spacecraft itself. Integration and test of the system module, the “brain” of the satellite, is complete. The “body” of the satellite, the core module comprising a majority of the structure and propulsion systems, was delivered in October. These modules were mated to form the spacecraft in late December.
GOES-S recently completed the technical portion of its system integration review, in which an independent team, spanning several engineering disciplines, determined that the flight and ground segment components are ready for integration with the overall GOES system. The review team also assessed the readiness of the facilities, support personnel, plans and procedures for integration of the GOES-S satellite.
Page 1 of 2
Share on:
Suggested Items
TTM Technologies Unveils New Xinger High-Performance 50W (AVG) Couplers
05/30/2024 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler.
Delvitech’s Cutting-Edge Technology Overcomes the Conventional Boundaries of Optical Inspection at SMT Connect
05/29/2024 | DelvitechNot only does Delvitech offer an innovative solution aimed at revolutionizing automatic 3D optical inspection through seamless integration of artificial intelligence, but it stands out as the sole provider to deliver exceptional results in inspecting electronic components previously deemed challenging to assess.
Quantic Electronics Announces Acquisition of M Wave Design
05/20/2024 | Quantic ElectronicsQuantic® Electronics, a portfolio company of Arcline Investment Management, announced the acquisition of M Wave Design, a leading supplier of ferrite-based RF and Microwave components for aerospace, defense, and quantum computing applications.
PCB Market Size to Grow by $29.06B from 2024-2028
05/17/2024 | PRNewswireThe global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.