Graphic Group Exhibiting at DesignCon Show
January 18, 2016 | Graphic GroupEstimated reading time: 1 minute
Graphic Group, a global manufacturer of high-technology printed circuit boards, will be exhibiting at the DesignCon Show, Santa Clara Convention Center, Santa Clara CA on January 20 & 21. Graphic will feature an assortment of complex Rigid, Rigid Flex, Flex Circuit and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
The DesignCon Show features over 160 elite vendors and is the largest meeting of board designers, and is the ONLY event to address chip design engineers' chip/system/package challenges. Attendees will discover and evaluate the latest high-speed design tools, technologies and developments in the chip, board and system design industry. Graphic Group will be located in Booth 1251.
Graphic Group is one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, Graphic focuses on leading edge technology released to the most demanding international quality standards.
Graphic is an expert at prototyping and developing new "first to market" products. With facilities in the UK, United States and in China for medium to large volume production, the Graphic Group is able to offer the complete service from Application Engineering support to volume PCB manufacture.
HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind vias, buried vias, blind micro-vias, copper filled micro-vias, resin filled vias, stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic.plc.uk, www.graphic-usa.com and www.rigidflex-graphic.com
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.