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North American Wi-Fi Sensing CPE Installations to Surge to 112 Million by 2030

11/15/2024 | ABI Research
Wi-Fi Sensing uses Wi-Fi RF wave attenuation to detect presence and motion, offering a cost-effective, easily deployable solution. Major Wi-Fi chipset vendors supporting infrastructure markets are backing this technology.

NetVia Group Invests in KLA's Frontline InCAM Pro Software

11/14/2024 | Epec
NetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.

Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES

11/14/2024 | Boeing
Boeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.

International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6

11/14/2024 | Edy Yu, I-Connect007
HKPCA hosts the 22nd annual International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show), Dec. 4-6, at the Shenzhen International Convention and Exhibition Center (Bao’an) in Halls 5, 6, 7, and 8. With more than 600 global brands and emerging companies, it is one of the world's largest gatherings for the circuit board and electronic assembly industry. The theme of the event is "AI Powers the Future." It will focus on AI, high-end PCBs, high-performance materials, smart automation, and other hot topics. It will showcase innovative processes and technologies across the PCB and PCBA industry chain, bringing together global elites and resources to drive ongoing development.

TSMC Pioneering Circular Economy in Semiconductor Manufacturing

11/13/2024 | TSMC
TSMC marked a significant milestone in sustainable manufacturing with the inauguration of the Taichung Zero Waste Manufacturing Center.
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