When you shine a light on a conducting surface like silicon or graphene, that light jump-starts certain electrons into high-energy states and kicks off a cascade of interactions that happens faster than the blink of an eye. Within just a few femtoseconds — a thousand trillionth of a second — these energized electrons can scatter among other electrons like balls on a billiard table, quickly dissipating energy in an ultrafast process known as thermalization.
Now physicists at MIT have come up with a way to manipulate electrons in graphene within the first few femtoseconds of photo-excitation. With their technique, the researchers can redirect these high-energy electrons before they interact with other electrons in the material.
The team’s ultrafast control of high-energy electrons may ultimately lead to more efficient photovoltaic and energy-harvesting devices, which capture photo-excited electrons before they lose their energy to thermalization.
“We’re intellectually excited about whether this will have technological applications,” says Pablo Jarillo-Herrero, associate professor of physics at MIT. “It’s too soon to know, but there are certain angles of looking at this where it's clear there might be ways to engineer energy flow or transfer in ways that are novel. Now we need more people thinking about this.”
The group’s results are published this week in the journal Nature Physics. Jarillo-Herrero’s co-authors include lead author and graduate student Qiong Ma, along with Jing Kong, professor of electrical engineering and computer science, and Nuh Gedik, associate professor of physics.
Page 1 of 3
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
A Real Look at Today's PCB Design With Stephen Chavez
10/13/2026 | Marcy LaRont, I-Connect007What does it take to become a better PCB designer? At PCB West, I-Connect007’s Marcy LaRont talks with Stephen Chavez of Siemens and PCEA about the practical skills engineers need beyond traditional education. Chavez explains why mastering design tools, understanding manufacturability, and involving fabrication teams early are essential to successful designs. He also discusses the value of mentorship, industry certification, and conferences, offering practical advice for engineers looking to strengthen their skills and advance their careers.
Fresh PCB Concepts: Managing PCB Trace Width and Spacing
09/22/2026 | Team NCAB -- Column: Fresh PCB ConceptsAs a fabricator, I know that trace width and spacing are some of the first items reviewed when determining whether a PCB can be manufactured reliably. They may look like simple dimensions in the design data, but the ability to reproduce them consistently depends on several factors, such as the circuit's location, the copper weight used, the design density, and any additional plating requirements. These can all change what is realistically achievable.
FSQuality Circuits to Showcase Advanced PCB Manufacturing Capabilities at PCB West 2026
09/18/2026 | FSQuality CircuitsFSQuality Circuits (FQC), a leading Thailand-based manufacturer of advanced printed circuit boards, will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California.
Designers Notebook: Implementing Strategic Planning Principles for PCB Design
09/03/2026 | Vern Solberg -- Column: Designer's NotebookDeveloping multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).
DFM Mistakes Designers Make When Moving to ELIC
07/20/2026 | Anaya Vardya, American Standard CircuitsThe transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.