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Samsung Reportedly Achieves Technical Breakthrough, Stacking 3D DRAM to 16 Layers

06/05/2024 | PRNewswire
According to the news report from DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

05/29/2024 | GlobeNewswire
SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.

IDTechEx Report: Illuminating the Future of Lidar in Automotive

05/09/2024 | PRNewswire
In the rapidly evolving landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, sensor technologies have emerged as a pivotal force driving innovations in the automotive industry.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.

Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2

04/24/2024 | Vern Solberg -- Column: Designer's Notebook
The printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
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