Infrared Detector Industry: Many Innovations to Drive Arrays Costs Down
January 22, 2016 | Yole DéveloppementEstimated reading time: 3 minutes
In parallel, new pyroelectric technologies have been developed by specific companies (Pyreos, Irisys, DIAS infrared) with a strong focus on arrays’ development: from 1X8 to 64X64 pixels or 1x510 pixels. The main applications identified by Yole’s team are people counting, gas & flame detection as well as spectroscopy. In 2016, a new pyroelectric CMOS array technology will be introduced by Irlynx: the company will propose a very low pricing and target US$10 which is a key threshold to access to smart building applications. Beginning of November, the company already announced the completion of a €2 million Series A round of financing.
“In parallel with this technology fight, at Yole, we observe common parallel trends of increased functionality and cost reduction in the different detector markets”, asserts Yann de Charentenay, Senior, Technology & Market Analyst from Yole. And he details:
- Small detectors: detector manufacturers are increasing the added value of their solutions, by developing the resolution from dual to four pixels; they are also introducing the transition from analog to digital/calibrated sensors.
- Within the arrays area, Yole’s analysts distinguish medium and large arrays. Companies propose today medium arrays with a better resolution for faster/wider area detection. In parallel, regarding the large arrays, except for high value niche applications like retail sector people counting, cost reduction is clearly the main target. The objective is to get an access to new applications such as smart buildings applications, where market players are used to buying low-cost motion sensors.
Page 2 of 3
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.