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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.

PlayNitride to Acquire Lumiode, Accelerating Micro LED Development for Near-Eye Displays

12/22/2025 | TrendForce
PlayNitride Technologies announced that its board approved the acquisition of Lumiode Inc., a U.S.-based company, for US$2 million.

TRI Technology Collaboration with ITRI highlighted at SEMICON Taiwan

09/16/2025 | TRI
Test Research, Inc. joined the Ministry of Economic Affairs (MOEA) Pavilion at SEMICON Taiwan 2025, where its collaborative technology with the Industrial Technology Research Institute (ITRI) was recognized as a key innovation.

ITRI Named a Top 100 Global Innovator for the Ninth Time

04/28/2025 | PRNewswire
The Industrial Technology Research Institute (ITRI) was officially honored at the 2025 Top 100 Global Innovators Award Ceremony hosted by Clarivate in Taipei.

RTX to Develop Ultra-wide Bandgap Semiconductors for DARPA

10/03/2024 | RTX
Raytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors, or UWBGS, based on diamond and aluminum nitride technology that revolutionize semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications.
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