American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Frontline Releases InCAM 2.32
January 22, 2016 | Frontline PCB SolutionsEstimated reading time: 2 minutes
Released on January 10, 2016, InCAM 2.32 is a minor new version that introduces numerous workflow throughput enhancements, including the ability to run Step Compare in the background and to add multiple dimensions simultaneously. In addition, two new DFM functions improve the production process for HDI and IC-packaging boards.
New Features
Reduce the galvanic effect during the gold plating process
Run the new Non-Tieline Gold Galvanic Compensation DFM to calculate the gold/copper or copper/gold ratio that is below a defined threshold and take steps to reduce the galvanic effect during gold plating.
Apply etch compensation to the narrow parts of a surface
Use the new Patch Bottlenecks DFM to automatically detect locations where surface width is below the defined value and apply a patch to these locations, enabling the application of etch compensation to the narrow parts of a surface.
Quickly create dimensioned drawing with multiple dimensions
Create dimensioned drawings faster – (co)ordinate, linear or baseline dimensions – by adding multiple dimensions at the same time.
Get Step Compare results per layer as soon as they’re ready
Run Step Compare in the background while getting on with other tasks. Step Compare can run in parallel on different layers, delivering results one by one as they become ready, while the remaining layers continue processing.
Improved sub-assembly electrical testing
Optimize netlists and create an electrical testing program for sub-assembly testing.
Page 1 of 2
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.