American Made Advocacy: America, It’s Time to Reclaim Manufacturing Leadership
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
April 28, 2025 | iNEMIEstimated reading time: 1 minute
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products. The overall project objective was to assess the surface mount processability and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards. To date, the project has:
Phase 1 — developed assembly processes on selected low-temperature solder pastes
Phase 2 — conducted mechanical shock reliability evaluation
Phase 3a — assessed the temperature cycling fatigue reliability of BGA solder joints of two different sizes with homogeneous and heterogeneous microstructures, under three distinct temperature cycling protocols
Phase 3b Now Forming — Sign Up by May 31
Phase 3b is being organized to:
Assess the temperature cycling fatigue reliability of near eutectic SnBi solder joints with the upper dwell temperature being > 0.95 homologous temperature for the SnBi alloy and compare this with Phase 3a results of three other temperature cycling protocols with upper dwell temperatures <0.95 homologous temperature.
Assess the temperature cycling fatigue reliability of LTS reverse hybrid solder joint for the standard 0-100ºC protocol and compare it with full SAC305 and full LTS SnBi solder joints.
Call-for-Participation Webinar
If you didn't have a chance to join us for the Session 1 call-for-participation webinar, you can still log in on April 28/29 for Session 2. This webinar will provide an overview of project accomplishments to date and introduce the plan for Phase 3b. The Phase 3b project is open for sign-up until May 31, 2025.
This webinar is open to industry; advance registration is required.
Please note: You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile.
Session 2
Tuesday, April 29, 2025
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on Monday, April 28
Share on:
Suggested Items
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
epoxySet Launches UV-8675 – Deep Section, UV Cured Adhesive for PVC
02/19/2025 | epoxySetepoxySet introduces the UV-8675, acrylated urethane adhesive for bonding PVC, polycarbonate and most other plastics. Designed for bonding PVC tubing in medical devices, it also bonds well to glass and metals. This semirigid polymer offers high bond strength without causing stress cracks.