Scientists Create Atomically Thin Metallic Boron
January 25, 2016 | Argonne National LaboratoryEstimated reading time: 4 minutes
A team of scientists at the U.S. Department of Energy’s (DOE) Argonne National Laboratory, Northwestern University and Stony Brook University has, for the first time, created a two-dimensional sheet of boron – a material known as borophene.
Scientists have been interested in two-dimensional materials for their unique characteristics, particularly involving their electronic properties. Borophene is an unusual material because it shows many metallic properties at the nanoscale even though three-dimensional, or bulk, boron is nonmetallic and semiconducting.
Because borophene is both metallic and atomically thin, it holds promise for possible applications ranging from electronics to photovoltaics, said Argonne nanoscientist Nathan Guisinger, who led the experiment. “No bulk form of elemental boron has this metal-like behavior.”
Like its periodic table neighbor carbon, which appears in nature in forms ranging from humble graphite to precious diamond, boron wears a number of different faces, called allotropes. But that’s where the similarities end. While graphite is composed of stacks of two-dimensional sheets that can be peeled off one at a time, there is no such analogous process for making two-dimensional boron.
“Borophenes are extremely intriguing because they are quite different from previously studied two-dimensional materials,” Guisinger said. “And because they don’t appear in nature, the challenge involved designing an experiment to produce them synthetically in our lab.”
Although at least 16 bulk allotropes of boron are known, scientists had never before been able to make a whole sheet, or monolayer, of borophene. “It’s only in the recent past that researchers have been able to make tiny bits of boron at the nanoscale,” said Andrew Mannix, a Northwestern graduate student and first author of the study. “This is a brand new material with exciting properties that we are just beginning to investigate.”
Page 1 of 3
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.