Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar

11/12/2024 | SMTA
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.

2024 Stromberg Student Leader Scholarship Recipient Announced

11/05/2024 | SMTA
SMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.

Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®

11/04/2024 | Indium Corporation
Indium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

Tata Advanced Systems, Airbus Inaugurate C295 Final Assembly Line in Vadodara, India

10/28/2024 | Airbus
As a major milestone for India’s Aerospace & Defence industry, Tata Advanced Systems Limited (TASL) and Airbus inaugurated the Final Assembly Line (FAL) complex for the Airbus C295 aircraft in Vadodara, Gujarat in India.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in