-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Selecting a Wave Soldering System, Part 3
February 1, 2016 | Robert Voigt, DDM NovastarEstimated reading time: 1 minute

In the last column, we discussed the attributes of the various types of wave solder systems, the most common through-hole assembly system for small- to mid-volume operations. In this chapter, we will dive a little deeper and address board handling techniques. For wave soldering, there are three common methods of running boards:
1. Automated in-line system
2. Manual conveyor system
3. Palletized carrier system
Automated Inline System
This arrangement is usually tied in to a total PC board assembly line, where the conveyor simply moves assembled boards from the assembly stage through the wave solder machine and on to cleaning, finishing and other secondary operations. There is no manual interference at the solder machine; it’s a totally hands-off operation from beginning to end. Wave machines that run this way are usually very expensive and are used in high-volume repetitive operations. The Surface Mount Equipment Manufacturers Association (SMEMA) defines uniform specifications for in-line systems to assure that all the operations in an assembly environment transfer boards seamlessly from one machine to another, regardless of the manufacturer, machine model, etc.
- Pros: very efficient; reduces or virtually eliminates handling and manual labor
- Cons: very expensive; usually out of reach of low- to mid-volume contract assembly shops
- Typical cost range: often in excess of $100,000
Editor's Note: This article originally appeared in the January 2016 issue of SMT Magazine.
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.