Novel and Efficient Fabrication Technology for Cross-Shaped Memristor Array
February 2, 2016 | POSTECHEstimated reading time: 2 minutes
Along with the fast development of modern information technology, charge-based memories, such as DRAM and flash memory, are being aggressively scaled down to meet the current trend of small size devices. A memory device with high density, faster speed, and low power consumption is desired to satisfy Moore’s law in the next few decades. Among the candidates of next-generation memory devices, cross-bar-shaped non-volatile resistive memory (memristor) is one of the most attractive solutions for its non-volatility, faster access speed, ultra-high density and easier fabrication process.
Conventional memristors are usually fabricated through conventional optical, imprint, and e-beam lithographic approaches. However, to meet Moore’s law, the assembly of memristors comprised of 1-dimensional (1D) nanowires must be demonstrated to achieve cell dimensions beyond limit of state-of-art lithographic techniques, thus allowing one to fully exploit the scaling potential of high density memory array.
Prof. Tae-Woo Lee (Dept. of Materials Science and Engineering) and his research team have developed a rapid printing technology for high density and scalable memristor array composed of cross-bar-shaped metal nanowires. The research team, which consists of Prof. Tae-Woo Lee, research professor Wentao Xu, and doctoral student Yeongjun Lee at POSTECH, published their findings in Advanced Materials.
They applied an emerging technique, electrohydrohynamic nanowire printing (e-NW printing), which directly prints highly-aligned nanowire array on a large scale into the fabrication of microminiature memristors, with cross-bar-shaped conductive Cu nanowires jointed with a nanometer-scale CuxO layer. The metal-oxide-metal structure resistive memory device exhibited excellent electrical performance with reproducible resistive switching behavior.
This simple and fast fabrication process avoids conventional vacuum techniques to significantly reduce the industrial-production cost and time. This method paved the way to the future down-scaling of electronic circuits, since 1D conductors represent a logical way to extreme scaling of data processing devices in the single-digit nanometer scale.
They also succeeded in printing memristor array with various shapes, such as parallel lines with adjustable pitch, grids, and waves which can offer a future stretchable memory for integration into textile to serve as a basic building block for smart fabrics and wearable electronics.
“This technology reduces lead time and cost remarkably compared with existing manufacturing methods of cross-bar-shaped nanowire memory and simplifies its method of construction,” said Prof. Lee. “In particular, this technology will be used as a source technology to realize smart fabric, wearable computers, and textile electronic devices.”
This work was supported by the Center for Advanced Soft-Electronics as Global Frontier Project and the Pioneer Research Center Program through the National Research Foundation (NRF) of Korea funded by the Ministry of Science, ICT and Future Planning.
Suggested Items
Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
BAE Systems and Eaton Expand Collaboration to Deliver Electric Drive Solutions for Heavy-Duty Trucks
05/08/2024 | PRNewswireBAE Systems, a leader in electric propulsion, and Eaton, a global power management company, are expanding their collaboration to include electric vehicle (EV) solutions for heavy-duty trucks.
Coherix Partners with EMU on 'Factory of the Future' Technology Program
05/08/2024 | PRNewswireMichigan-based Coherix is working with Eastern Michigan University (EMU) in Ypsilanti to develop "factory-of-the-future" manufacturing and assembly technology.
2024 Apple iPad Pro Estimated to Ship Between 4.5 to 5 Million Units
05/08/2024 | TrendForceApple’s recent product launch in May introduced a lineup of new tablets featuring advanced AMOLED screens. Notably, the Pro version boasts a dual-layer tandem structure designed to address the longstanding challenges of screen burn-in and lifespan that are common with AMOLED displays.
Simbe Partners with Plexus to Scale Manufacturing and Meet Global Retail Demand
05/08/2024 | Globe NewswireSimbe, the leading provider of Store Intelligence™ solutions that increase retailer performance through unprecedented visibility and insights, today announced a partnership with Plexus Corp. to bring its best-in-class retail robotics-as-a-service to market quickly and at global scale.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in