Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Cirexx Develops ECLIPS Demonstration Module
February 23, 2016 | CirexxEstimated reading time: 1 minute
Cirexx International announced today that they have developed a module to demonstrate their ECLIPS technology. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics and a very low-CTE.
The Cirexx ECLIPS technology serves as an alternative to co-fired ceramics and hybrid integrated circuits. The item is essentially a common Printed Circuit Board, made from otherwise typical RF/microwave Printed Circuit Board materials and processes. But with a high thermal conductivity and very low CTE the user can mount very fine pitch devices and in fact direct attach/wire-bond bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This combination results in an electronic board system that is smaller, lighter weight, easier to make revisions to and certainly much less costly than the ceramic hybrid, all-die alternative.
The demonstration module allows Cirexx Application Engineers to demonstrate the technology at customer facilities and/or during ECLIPS presentations. With the use of common lab equipment the module demonstrates the efficient evacuation of heat generated by 2 bare die amplifiers and its effect on the power output. Cirexx President and CEO Philipp Menges said, “This Demo Module is another tool available to help our customers understand and evaluate the ECLIPS technology.”
About Cirexx International
Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Design, PCB Fabrication and PCB Assembly of high-reliability Printed Circuit Boards, RF/Microwave Circuit Boards, Flexible Printed Circuits and Rigid-Flex Circuit Boards. Recognized as a time-technology leader, the company offers a genuine Quick Turn service and provides a one stop shop and all in-house solution known as Seamless Integration. Cirexx has expertise fabricating high layer count Printed Circuit Boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation.
Share on:
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.