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Sundell Technology Laying the Groundwork for a ‘Certain’ Future

11/04/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
In early September, Edy Yu and Tulip Gu of ECIO, and I-Connect007’s Marcy LaRont visited Sundell Technology’s Thailand facility at the Rojana Industrial Park in Ayutthaya Province. Two years into operation, the factory has devoted considerable investment and effort to things that are largely “invisible.” Registered in February 2023 and commencing production in 2024, the company has invested nearly RMB 1.2 billion in the facility, which covers approximately 267,000 square meters and was initially planned for a monthly production capacity of 120,000 square meters.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

The Fearless Connector: Why I Chose the Hard Road

10/14/2026 | Echo Yang -- Column: The Fearless Connector
From the outside, entrepreneurship can look exciting. You see the company name, the website, the customer meetings, and the photographs from business trips on social media. You also might see progress, but you do not always see the uncertainty behind it.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion

Real Time with... THECA 2026: Global Electronics Association on PCB Growth, Standards, and Emerging Technology

09/04/2026 | Real Time with... THECA
David Bergman, VP of International Relations at the Global Electronics Association, talks with Marcy LaRont about his privilege in being involved in THPCA from early on and the strategic opportunity for the Association to make a difference in Thailand's growing electronics industry through standards and education. Also as an active member of the Electronic Circuit World Council (ECWC) (which occurs every three years) Mr. Bergman discusses plans for ECWC17 which will take place next year with THECA 2027, highlighting Thailand's role in electronics manufacturing.
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