Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Advanced Copper Foil (ACF) to Display Full Line of Circuit Foil Copper Foils at IPC APEX 2016
March 8, 2016 | Advanced Copper FoilEstimated reading time: 1 minute
Having signed an exclusive distribution agreement with Circuit Foil Luxemburg in 2015, ACF is now fully ready to provide value-added copper foil products to all regions of the United States and Canada.
ACF welcomes customers and will be exhibiting its full line of Circuit Foil Copper Foils and Aluminum Supported Copper Foils at the IPC/APEX Show in Las Vegas March 15-17, Booth 447.
Foils for the PCB Manufacturer
On display will be standard shiny foils, high bond/Polyimide foil, low loss, ultra-low loss and HVLP foils. There will be a complete display of LP, VLP, HVLP and foils with “Almost No Profile” (Rz ≤ 1.3um). ACF also offers a host of specialty foils for PTFE, Flexible Circuits, ultra-thin foils (≤ 2um) and foils specially designed for High Speed Low Loss Laminates.
Copper Foil with Aluminum Carrier
See both the AFC2, Single-sided Aluminum, and the ACF3, Double-sided Copper Aluminum Copper layers. Manufactured in a clean-room, the ACF family of products guarantee a pristine copper surface, free of debris and other foreign materials. These products also protect the copper surface from epoxy spots and finger prints during the Multilayer Layup process. The unique process, established with complete cleanliness in mind, does not require aluminum shearing during the manufacturing process as others products do. This in conjunction with our unique tooling and proprietary panel cleaning processes allows ACF to guarantee our customers the highest quality panels without the concern of aluminum particles or other foreign materials, with any tooling configuration required.
Special Shielding and Battery Foils
Complete line of foils for industrial markets such as battery and shielding, as well as our foils for PCB application.
About ACF
Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. ACF2 and ACF3 aluminum supported foils are products that facilitate the PCB layup process, improve efficiencies and provide a carrier for ultra-thin foils. We are committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today.
For further information visit: www.advancedcopperfoil.com
Share on:
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.