-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Committee Works to Develop Shop Floor Communication Standard
March 18, 2016 | IPCEstimated reading time: 1 minute

On Wednesday, March 16, at IPC APEX EXPO, IPC’s 2-13 Shop Floor Communications Subcommittee brought together leading software developers, machine vendors, assembly equipment manufacturers and their customers to work on development of a new IPC standard to meet the current and future needs of industry that will fill a gap identified by the group. This new standard will provide uniformity of data protocols that will allow ease of machine to machine communication.
“The subcommittee is firmly committed to developing the standard and is also working to provide an easy-to-understand definition of Industry 4.0 and its significance,” said Subcommittee Chairman Jason Spera, CEO of Aegis Software. “The group is working to identify additional committee leaders from the customer and machine side.”
“Machine vendors want to engage quickly and all parties agree that a replacement for the current IPC-2541, Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX) is needed and demanded by industry and speed of execution is critical,” said David Bergman, IPC vice president of standards and training. “During the meeting two commercial initiatives were presented, and based on those two presentations, the subcommittee realized that several licensing and intellectual property issues need to be resolved before the new standard can progress. The subcommittee also determined that the IP cannot be controlled by any entity other than IPC, nor a revenue generator for any company contributing to the standard.”
For more information on this evolving standard and 2-13 subcommittee activities, contact Bergman, at DavidBergman@ipc.org or +1 847-597-2840.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
02/06/2025 | IPCA new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.
Advancements in Thermal Management: Material Talk With DuPont
02/06/2025 | Marcy LaRont, I-Connect007As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines.
European Chip Giants NXP, STMicroelectronics Prepare for Layoffs
02/06/2025 | I-Connect007 Editorial TeamWhile companies like NVIDIA dominate the headlines with announcements of record chip sales associated with AI, European chip makers that are more dependent on industrial and automotive electronics are under pressure as demands for their chips slow. NXP, headquartered in the Netherlands, recently announced disappointing financials, down 5% from the previous year, primarily due to softening demand in those markets.
First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries
02/06/2025 | IPCThe first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
02/06/2025 | MacDermid Alpha Electronics SolutionsIn an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.