Pro-Tech Expands Scope of Military Qualification MIL-PRF-31032
March 21, 2016 | Pro-Tech Interconnect SolutionsEstimated reading time: Less than a minute
Pro-Tech Interconnect Solutions has announced that the company has expanded the scope of its key military certification, MIL-PRF-31032/MIL-PRF-55110. The newest capabilities are the result of ongoing capital investment in leading edge technology as well as continuous advancements to our quality management and production capabilities. Several increased capabilities of note include maximum number of layers to 16, minimum mechanical hole size of .0059", aspect ratio of 15:1, and 5 mil laser vias with 1:1 ratio utilizing full via fill copper.
About Pro-Tech Interconnect Solutions, LLC.
Pro-Tech is a Minnesota-based premier manufacturer of high-reliability printed circuit boards for the military, aerospace, medical, industrial, homeland security and avionics industries focusing on prototype to medium volumes including HDI quick turn and heavy copper demands. Pro-Tech’s current certifications include ISO 9001:2008, AS9100C, ISO 13485:2003, MIL-PRF-31032 along with ITAR registration.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.