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IPC APEX EXPO: AIM's O'Neill Highlights M8 Solder Paste
March 22, 2016 | Real Time with...IPCEstimated reading time: Less than a minute
Timothy O'Neill, technical marketing manager at AIM Solder, updates I-Connect007 Guest Editor Mark Thompson about the company's M8 solder paste, which they launched at last year's APEX. O'Neill discusses how the product improves print quality and reduces voiding on bottom terminated devices. O’Neill also mentions about the impact of reduced solder alloy powder size on solder paste print performance.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
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