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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Fresh PCB Concepts: Don't Let Over-specification Come Back to Haunt You

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In my career, I never imagined a shortage of FR-4 materials like the one we see today, a situation that has frustrated both PCB manufacturers and customers. FR-4 materials are highly substitutable when compared to exotic materials, so if a factory does not have one specific brand of FR-4, they will typically have an equivalent material in stock. This forces our customers to choose between waiting an unreasonable amount of time for the branded materials to arrive at the factory and waiting a slightly shorter time for the substituted materials.

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From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.
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