New Technique for Advanced Printed Electronics
March 23, 2016 | AISTEstimated reading time: 5 minutes
Figure 2: (a) Schematic of synchrotron X-ray diffraction experiment and diffraction pattern of plate-like crystal, (b) Molecular packing structure within crystals, (c) Schematic of molecular chain and polarization alignment on substrate surface.
A capacitor-type device using the plate-like crystals with about 1 μm thickness exhibited quasi-rectangular loops in the electric polarization (P) versus electric field (E) hysteresis experiments without additional thermal annealing (Fig. 3a). The devices exhibited polarization switching at a very low voltage of about 3–4 V at 10 Hz. The fatigue characteristics of switching were evaluated at frequencies of 10, 100, and 1000 Hz. The ferroelectric properties could be maintained until hundreds of thousands cycles at 1000 Hz (Fig. 3b). The researchers expected that the fatigue characteristics could be improved by optimizing the device structure.
Figure 3: Ferroelectric properties of the developed single-crystalline thin film
(a) Electric polarization (P) versus electric field (E) hysteresis loops. (b) Fatigue characteristics at frequencies of 10, 100, and 1000 Hz
Piezoresponse force microscope (PFM) characterization provides microscopic information about the polarization reversal. Figure 4a shows various sizes of polarization reversal domains obtained by applying a constant DC bias of +20 V to the tip with a pulse duration varying from 10 to 1000 ms for a 1.0 µm thick film. The minimum domain size was ≈500 nm, whereas it increases logarithmically with increasing a pulse duration (Fig. 4b). This domain was found to be stable for at least 40 h under ambient pressure at room temperature. Phases of PFM images reveal that the polarization changes by not 90 degrees but 180 degrees (Fig. 4c).
Figure 4: Local polarization reversal by using a piezoresponse force microscope (PFM)
(a) PFM phase image of written domains. (b) Size variation of polarization reversal domains as a function of pulse duration for an applied electric field. (c) Phase images of vertical and lateral directions
Future Plans
The researchers aim to develop manufacturing technologies of all-printed electronics devices by combining the developed printing technique for thin film formation and other printing techniques for fabricating metal wires and semiconductor thin films.
Page 3 of 3Suggested Items
The ICAPE Group Invests in Jiva Materials to Drive Eco-Friendly PCB Innovation in Europe
11/27/2024 | BUSINESS WIREICAPE Group, a global technology distributor of printed circuit boards (“PCB”) and custom-made electromechanical parts, today announced it will be acquiring a minority shareholding in Jiva Materials Ltd, a UK-based innovator and the developer of Soluboard® - the world’s first fully biodegradable PCB substrate.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Global Citizenship: What I’ve Learned About the American PCB Business
11/20/2024 | Tom Yang -- Column: Global CitizenshipNavigating the complexities of the American PCB business has been an eye-opening experience. During my time in America, I have become more familiar with the American PCB business and doing business here. If I may, and with your indulgence, I would like to share my humble impressions of the American PCB industry and the American way of doing business, which I find interesting and admirable.
Spirit Announces Purchase Agreement with Tex Tech Industries for Intended Sale of FMI
11/19/2024 | Spirit AeroSystems, Inc.Spirit AeroSystems Holdings, Inc. announces a purchase agreement to sell Fiber Materials, Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex-Tech Industries, Inc. for $165,000,000 in cash, subject to customary adjustment.
Ventec to Become Primary PCB Materials Supplier for Teltonika
11/13/2024 | VentecVentec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.