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Mentor Graphics Releases Newest HyperLynx
April 4, 2016 | PRNewswireEstimated reading time: 5 minutes
Simulating every detail of a PCB's signal routing and power delivery is overwhelming. Tuning raw simulation capabilities to the specific requirements of standard interfaces and protocols (like DDRx memory and 100-Gb/s Ethernet SERDES) eases the user's burden and provides streamlined, summary pass/fail judgment on entire interfaces. The HyperLynx wizard for DDRx memory interfaces pioneered easy setup, automated whole-bus simulation, and consolidated results reporting – and is now extended to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results.
In the SERDES arena, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. The new HyperLynx tool offers the industry's first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated.
Staying true to its heritage of ease-of-use and fast interactive analysis, this more robust HyperLynx version can efficiently handle very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and re-use of extracted models.
Leveraging Tools, Process and Education
In addition to improving products, Mentor is empowering engineers to tackle emerging challenges through a global educational workshop series partnering with industry expert Eric Bogatin. The series will address new high-speed technologies, as well as best-in-class methodologies, tools and processes to effectively adopt the technologies.
"At 28 Gbps and above, everything matters, and engineers must understand the essential signal integrity principles that connect physical design with electrical performance in the very high speed regime. To meet the demands of next-generation products, the successful engineer must accelerate up the learning curve," stated Dr. Eric Bogatin, adjunct professor at ECEE, University of Colorado, Boulder, and director of the Teledyne LeCroy Front Range Signal Integrity Lab. "One of the most effective ways of learning and understanding the essential design principles is through exploring virtual prototypes using simulation tools like Mentor Graphics HyperLynx with its very low learning curve."
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
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06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.