Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Mentor Graphics Releases Newest HyperLynx
April 4, 2016 | PRNewswireEstimated reading time: 5 minutes
Simulating every detail of a PCB's signal routing and power delivery is overwhelming. Tuning raw simulation capabilities to the specific requirements of standard interfaces and protocols (like DDRx memory and 100-Gb/s Ethernet SERDES) eases the user's burden and provides streamlined, summary pass/fail judgment on entire interfaces. The HyperLynx wizard for DDRx memory interfaces pioneered easy setup, automated whole-bus simulation, and consolidated results reporting – and is now extended to DDR4 and LPDDR4 interfaces. HTML-based reporting allows creation of design documentation and internal Web-based "publication" of results.
In the SERDES arena, protocols that support Channel Operating Margin (COM) allow checking the quality of links based on a specific, complex set of simulation steps for a single pass/fail number per-channel. The new HyperLynx tool offers the industry's first robust commercial implementation of COM for 100GbE signaling, with simulation details fully automated.
Staying true to its heritage of ease-of-use and fast interactive analysis, this more robust HyperLynx version can efficiently handle very large layouts (including extra-deep stack-ups, huge net counts, and entire multi-board systems); multi-processor and other simulation-engine performance enhancements; and caching and re-use of extracted models.
Leveraging Tools, Process and Education
In addition to improving products, Mentor is empowering engineers to tackle emerging challenges through a global educational workshop series partnering with industry expert Eric Bogatin. The series will address new high-speed technologies, as well as best-in-class methodologies, tools and processes to effectively adopt the technologies.
"At 28 Gbps and above, everything matters, and engineers must understand the essential signal integrity principles that connect physical design with electrical performance in the very high speed regime. To meet the demands of next-generation products, the successful engineer must accelerate up the learning curve," stated Dr. Eric Bogatin, adjunct professor at ECEE, University of Colorado, Boulder, and director of the Teledyne LeCroy Front Range Signal Integrity Lab. "One of the most effective ways of learning and understanding the essential design principles is through exploring virtual prototypes using simulation tools like Mentor Graphics HyperLynx with its very low learning curve."
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777.
Page 2 of 2Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for the Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.