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The Pulse: Overconstraining: Short, Slim, and Smooth

06/06/2024 | Martyn Gaudion -- Column: The Pulse
Engineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.

Overconstrain? Underconstrain? Selecting Materials for High-speed Designs

06/06/2024 | Andy Shaughnessy, Design007 Magazine
When selecting materials for a high-speed design, you need to be very familiar with the materials’ electrical characteristics, as well as the requirements of the PCB you’re designing. There are myriad details that need to be considered during the material selection process, and missing one iota can lead to your job being put on hold. We asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.

Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4

06/05/2024 | Happy Holden -- Column: Happy’s Tech Talk
A special case of rigid board applications is when you would like to bend the board but don’t need it to flex. We have called this case “bend-to-install” or sometimes “semi-flex”. Many electronics applications are in this class of assembly, as illustrated: Rigid board needing height adjustments, automotive lighting, industrial cameras, engine control units, and and-held portable units.

ASC Sunstone Talks Imaging in Latest Podcast Episode

06/06/2024 | I-Connect007
Each circuit board is composed of a one-of-a-kind pattern of metal connections representing the specific design for that circuit. So, how do those unique features get mapped onto the board? Find out in this episode as Matt Stevenson paints a picture of the outer layer imaging process.

New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce

06/04/2024 | SEMI
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce.
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