Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha Presents Technical Papers at SMTA China East Technical Conference 2016
April 11, 2016 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will present two technical papers “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance” and “Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies” at SMTA China East Technical Conference 2016 in Shanghai, China.
The first paper is “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance”. As known, electrochemical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrochemical reliability of printed circuits. Therefore, this paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues.
The second paper is “Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies”. Board warpage in fiber-glass epoxy laminate boards known as “FR” boards, is familiar phenomenon seen in traditional electronics manufacturing. The growth of the LED general lighting market has propelled the usage of high-aspect ratio boards where the length is significantly greater than the width FR type boards for a variety of applications. A significant percentage of these boards are adopted for linear lighting applications where warpage of the PCBs is most commonly seen. This paper will present a structured study to characterize the effect of warpage “bow” driven by different assembly process conditions on FR circuit boards with two dissimilar glass-transition properties designed as high aspect ratio linear lighting strips.
For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com
SMTA China East Technology Conference
Date: April 26 -27, 2016
Venue: Shanghai World Expo Exhibition & Convention Center, Shanghai, China
Presentation: Tuesday, April 26th / 11:05am-11;40am in Room No. 6-B1
Topic: The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance
Speaker: William Yu – Alpha Assembly Solutions
Presentation: Wednesday, April 27th / 11:40am-12:15noon in Room No. 5-B1
Topic: Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies
Speaker: William Yu – Alpha Assembly Solutions
Speaker Biography
William Yu is the Technical Service Manager for Alpha and his key responsibilities includes provision of technical and applications support, and providing advice & recommendations to a vast array of customers in mainland China. He is a member of IPC SPVC China. William joined Alpha N-China in June 2004 as a Customer Technical Service (CTS) engineer and became CTS manager in 2005. William has been at the forefront of Alpha' representation in key technical seminars and training sessions in N-China area and has more than 10 years of experience in the SMT Industry.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.