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Vi TECHNOLOGY to Exhibit at NEPCON Shanghai
April 13, 2016 | Vi TECHNOLOGY’Estimated reading time: 1 minute
Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in WKK’s Booth # 1F40 as well as First Technology’s Booth # 1G50, and American Tec’s Booth #1H45 at the upcoming NEPCON Shanghai, scheduled to take place April 26-28, 2016 at the Shanghai World Expo Exhibition and Convention Center in China.
In WKK booth 1F40, Vi TECHNOLOGY will display PI and 5K3D Machines. The PI Series allows the easy implementation of Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results. With reduced footprint, all models are fitting in modern assembly lines. PI Series is automatic, accurate and repeatable, meeting your advanced SPI requirements with unprecedented simplicity. The 5K3D inline AOI, based on its 2D AOI, features two laser cameras and one beam. The 3D sensor has 1 micron resolution.American Tec will also exhibit Vi TECHNOLOGY equipment in their booth.
In the First Technology booth 1G50, you will find the 7K machine. The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors respond to floor-space constraints as well as AOI productivity concerns to meet customer expectations regarding cost/quality optimization. The 7K DL Series benefits from all our latest innovations and also provides enhanced color viewing on the DefectViewer station to facilitate operator repair jobs. The system includes the latest Vi TECHNOLOGY’s software suite and P-Series acquisition heads with the i-LITE lighting system. It offers the same hardware and software upgradeability as the 5K Series and is also compatible with the 3K platform, having P-Series optical heads. The 7K DL Series ensures accuracy, repeatability and a short cycle time.
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