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Beyond Design: Dielectric Material Selection Guide

05/23/2024 | Barry Olney -- Column: Beyond Design
Materials used for the fabrication of multilayer PCBs absorb high frequencies and reduce edge rates. That loss in the transmission line is a major cause of signal degradation. However, not all of us are designing cutting-edge boards and sometimes we tend to over-specify requirements that can lead to inflated production costs. In this month’s column, I will look at the types of materials commonly used for PCB design and how to select an adequate material to minimize costs.

Physicists Create Optical Component for 6G

05/20/2024 | Skoltech
A joint team of physicists from Skoltech, MIPT, and ITMO developed an optical component that helps manage the properties of a terahertz beam and split it into several channels.

High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point

05/14/2024 | Real Time with...IPC APEX EXPO
In an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.

epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting

05/13/2024 | epoxySet
epoxySet introduces the EC-1015HP epoxy potting compound.  This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies.  As a low viscosity encapsulant, it is used for large and small potting applications with fragile components. 
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