Alpha to Present at the Exhibitor Forum at SMT Hybrid Packaging 2016

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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present at the Exhibitor Forum at the SMT Hybrid Packaging Show which runs from Tuesday 26^th –Thursday 28^th April at the Exhibition Centre in Nuremberg.

Alpha’s Area Sales Manager for the DACH Region, Jan-Henryk Serzisko, will present on Alpha’s extensive range of product solutions to solve reliability issues. During his presentation, Mr. Serzisko will focus on ALPHA® Exactalloy® Preforms, one of the many solutions Alpha offers to increase reliability in electronic assemblies. He will elaborate on how Exactalloy® Preforms are used to precisely increase the solder volume in solder joints. This results in increased strength of the solder joints, enabling them to withstand harsh operating conditions and improve conductivity.

At the exhibition, Alpha will display an advanced range of solder pastes, including ALPHA® CVP-390, a zero-halogen, no-clean solder paste that can be used to increase reliability. CVP-390 provides excellent pin testing and consistent fine pitch printing capabilities. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability.

Jan-Henryk Serzisko will be presenting at the SMT Hybrid Packaging Exhibitor Forum on Thursday 28^th April at 10.40am. The Forum is free with admission to SMT Hybrid Packaging.

For more information on Alpha’s product range visit Alpha at SMT Hybrid Packaging in Hall 7 Stand 109 where Alpha will be co-exhibiting alongside smartTec, its distributor for Germany, Denmark, Sweden and Norway or visit the Alpha website.

SMT Hybrid Packaging

Date: Tuesday 26^th – Thursday 28^th April

Venue: Exhibition Centre, Nuremberg, Germany

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.