Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Mirtec’s Mv-6 Omni 3D AOI Machine Wins Top SMT China Vision Award
April 27, 2016 | MirtecEstimated reading time: 1 minute
MIRTEC, “The Global Leader in Inspection Technology,” was awarded the 2016 SMT China Vision Excellence Award in the category of AOI inspection & testing for its MV-6 OMNI 3D AOI system. The award was presented to the company during a ceremony that took place April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. MIRTEC’s MV-6 OMNI received the SMT China Vision Excellence Award for earning the top score in the AOI category.
Brian D’Amico, president of MIRTEC’s North American Sales and Service Division, said, “The SMT China Vison Excellence Award represents the 29th industry award that has been presented to MIRTEC in recognition of our technologically advanced inspection solutions. It is an honor to receive this award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of our MV-6 OMNI 3D AOI machine.”
The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION3D Inspection Technology that combines 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost-effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with their complete product range of 3D inspection systems.
MIRTEC’s Digital Multi-Frequency Quad Moiré Technology, provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder joint integrity post-reflow. Fully configured the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down CoaXPress Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment is measured.
SMT China magazine launched the SMT China Vision Awards in 2007 to recognize both international and domestic providers of SMT equipment, materials, software and services that have made outstanding contributions to the rapid growth of China's electronics manufacturing industry by their inventions and innovations.
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.