Alpha Assembly Solutions Wins Prestigious Awards at NEPCON CHINA

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Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, is pleased to announce that it has received 4 awards at NEPCON CHINA recognizing its high level of achievement in soldering products technology. These prestigious awards were presented to Alpha by SMT China and EM Asia, two leading publications covering electronics assembly technologies in the Asia Pacific. The awards presented to Alpha include:

SMT China Vision Awards:

ALPHA OM-535 Solder Paste wins “Solder Paste” under the SMT Assembly Materials category

ALPHA High Temperature Dipping Alloys wins “Solder Alloy” under the SMT Assembly Materials category

EM Asia Innovation Awards:

ALPHA OM-535 Solder Paste wins “Solder Paste” under the Materials category

ALPHA High Temperature Dipping Alloys wins “Other Soldering Materials” under the Materials category

ALPHA OM-535 Solder Paste

ALPHA OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market. The great performance improvement of SBX02 alloy enhanced by the chemistry performance that contributes to the formation of a better solder joint with improved mechanical performance and better solder joint cosmetic.

ALPHA High Temperature Dipping Alloys

ALPHA High Temperature Dipping Alloys includes SnCX-FT07, SACX0307-FT and SnCu3-FT that make up Alpha Assembly Solutions family of lead-free solder alloys for high temperature dipping and tinning applications. Those alloys have been engineered to generate minimal surface oxides and to be highly reflective after hours of high heat exposure compared to the other popular alloys such as SnCu0.7 and SnCu3. Each alloy exhibits excellent wetting characteristics. In addition, fast wetting and low oxidation rates help increase overall production yields.

Visit the Alpha Assembly Solution site to learn more about our global services and capabilities and unique process technology.

About NEPCON CHINA

NEPCON CHINA is one of the biggest and longest standing trading and sourcing platforms in Asia featuring all major brands in the electronics manufacturing world.  The exhibition will cover a floor area of 25,000 sqm and bring together over 500 leading companies from 22 countries and regions and 21,000 industry leaders and trade professionals.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.