-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Coast to Coast Circuits Continues to Focus on Technology with the Addition of DIS's Direct Optical Registration
May 2, 2016 | Coast to Coast CircuitsEstimated reading time: 2 minutes
Coast to Coast Circuits, Inc (formerly PJC Technologies, Inc. DBA Speedy Circuits and Metro Circuits) announced today that it has added Direct Optical Registration at its California operations. The system/process is developed by DIS Inc of Islandia, N.Y. to increase layer-to-layer alignment accuracy for the company’s prototype and production-volume printed circuit board business.
Direct Optical Registration™ allows for optical alignment of innerlayers during the lay-up process of multilayers and sequential build-up technology, eliminating the need to manually punch and pin individual layers prior to lamination. Tolerance buildup and variability associated with traditional pin lamination systems is eliminated.
A vision and positioning system sequentially align and clamp layers together utilizing a full platen, assuring coplanarity and accuracy. The aligned multilayers are welded together with SmartWeld™, the patented coupled induction welding system developed by DIS Inc.
In addition, Direct Optical Registration™ provides an opportunity to utilize X-ray inspection to quantify registration of welded multilayers prior to lamination. The panel can then be measured after lamination, providing the data to analyze the lamination process and take corrective actions if necessary. Some of the leading edge requirements placed on pcb shops utilizing pin technologies are not able to be met unless they introduce Direct Optical Registration.
Abbas Hosseinzadeh, Coast to Coast Circuits, Inc. process engineering manager notes, “The DIS bonding machine provides excellent layer-to-layer registration thus reducing tolerance build up. This allows us to manufacture products with tighter annular ring requirements and increases overall process capabilities.”
About Coast to Coast Circuits, Inc. (Formerly PJC Technologies, Inc. DBA Speedy Circuits and Metro Circuits)
Coast to Coast Circuits, Inc. is a leading fabricator of advanced printed circuit boards (PCBs) using a variety of standard and advanced materials. They use leading edge technology, state of the art equipment, industry leading quality systems and an experienced workforce to produce the most challenging PCBs. They have been proudly serving their valued customers in defense, semiconductor, medical, instrumentation, wireless and specialty interconnect industries for 40 years. Coast to Coast Circuits, Inc. provides innovative PCB solutions with superior quality, service, performance, and reliability, click here.
About DIS Inc.
DIS Inc. is a worldwide leader in optical registration systems for the printed circuit board industry and an innovative producer of inner-layer/sub-lam registration and welding equipment. DIS has developed Direct Optical Registration™, a new method of optically registering and welding inner-layers/sub-lam such that registration is improved by eliminating mechanical tooling, operational cycle times are reduced and process flexibility is increased all while significantly reducing operating costs. For more information, visit www.distechnology.com.
Suggested Items
I-Connect007 Technical Library: Your Ultimate Free Knowledge Resource
05/12/2025 | Barb Hockaday, I-Connect007I-Connect007’s technical library was created in 2016 with the launch of its first title, "The Printed Circuit Buyer’s Guide to AS9100 Certification." Created to satisfy a need for readily available, free technical resources, the library has become a powerful knowledge hub for the printed circuit board and electronics manufacturing supply chain.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.