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Elephantech Launches World’s Smallest-Class Copper Nanofiller
July 17, 2025 | ElephantechEstimated reading time: 1 minute
Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Synthesized using Elephantech’s proprietary technology developed over years of R&D, the newly released copper nanofiller consists of ultra-fine, uniformly produced particles averaging 15 nm in size. It exhibits exceptional dispersion stability for over 6 months. In addition to storage stability, the material also enables simplification of process by allowing low-temperature wet reduction at 60℃.
Supported by these specifications, the copper nanofiller offers excellent features, including high electrical conductivity, low resistivity, and thermal conductivity. Its flexibility across supply formats -from inks to pastes- enables a wide range of applications, such as:
Upon its debut, Elephantech has received significant inquiries and intentions about adopting this best-in-class material in their products and solutions. By elevating the performance standards in its category, the innovative copper nanofiller is poised to help more manufacturers unlock new potential.
Building on its extensive experience in printed circuit board (PCB) development and manufacturing solutions, Elephantech is now expanding the value of its nano-materials portfolio while maintaining its focus on the PCB sector. With a strong foundation in science innovation and a longstanding commitment to sustainability, the company continues to drive momentum to accelerate transformation across the electronics industry.
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11/17/2025 |I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Elephantech's SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens
10/06/2025 | ElephantechElephantech Inc. is pleased to announce that its proprietary flexible printed circuits (FPCs) have been adopted for mass production by OM Digital Solutions Corporation in the company’s latest flagship products.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.