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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Elephantech Launches World’s Smallest-Class Copper Nanofiller
July 17, 2025 | ElephantechEstimated reading time: 1 minute
Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Synthesized using Elephantech’s proprietary technology developed over years of R&D, the newly released copper nanofiller consists of ultra-fine, uniformly produced particles averaging 15 nm in size. It exhibits exceptional dispersion stability for over 6 months. In addition to storage stability, the material also enables simplification of process by allowing low-temperature wet reduction at 60℃.
Supported by these specifications, the copper nanofiller offers excellent features, including high electrical conductivity, low resistivity, and thermal conductivity. Its flexibility across supply formats -from inks to pastes- enables a wide range of applications, such as:
Upon its debut, Elephantech has received significant inquiries and intentions about adopting this best-in-class material in their products and solutions. By elevating the performance standards in its category, the innovative copper nanofiller is poised to help more manufacturers unlock new potential.
Building on its extensive experience in printed circuit board (PCB) development and manufacturing solutions, Elephantech is now expanding the value of its nano-materials portfolio while maintaining its focus on the PCB sector. With a strong foundation in science innovation and a longstanding commitment to sustainability, the company continues to drive momentum to accelerate transformation across the electronics industry.
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Elephantech Secures Mitsubishi Electric Investment to Boost SustainaCircuits Globally
03/12/2026 | ElephantechElephantech Inc. announced a strategic partnership with Mitsubishi Electric Corporation. As part of the agreement, Mitsubishi Electric will invest JPY 4 billion in Elephantech’s Series F financing.
Elephantech to Exhibit at Semicon Japan 2025
11/28/2025 | ElephantechFrom December 17–19, Elephantech will be exhibiting at Semicon Japan 2025 at Tokyo Big Sight.
Elephantech to Showcase Thick-Copper FPC and Ultra-Fine Copper Nanofiller at AABC 2025
11/26/2025 | ElephantechElephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA.
Voices of the Industry Features Elephantech’s Satoshi Konagai on the Future of Sustainable PCB Manufacturing
11/19/2025 | I-Connect007I-Connect007 is pleased to announce the release of the latest episode in its acclaimed podcast series, Voices of the Industry. In this episode, host Marcy LaRont speaks with Satoshi Konagai, Executive Officer and Head of Marketing of Elephantech, about the company’s groundbreaking additive manufacturing technology that’s reshaping the printed circuit board (PCB) industry.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.